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发明名称
A material for use in manufacturing a housing for electronic components
摘要
申请公布号
GB2225327(A)
申请公布日期
1990.05.30
申请号
GB19890024855
申请日期
1989.11.03
申请人
* KITAGAWA INDUSTRIES CO LIMITED
发明人
ASAHARU * NAKAGAWA;MORINOBU * ENDO
分类号
H01B1/24;H05K9/00
主分类号
H01B1/24
代理机构
代理人
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