THERMOSETTING-RESIN-FORMING COMPOSITIONS

摘要

This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: wherein R represents a divalent group of or , X being a direct bond or a group selected from the group consisting of divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.