| 摘要 |
PURPOSE:To prevent fine metal wires or the fine metal wires and inner leads from coming into contact directly to each other by a method wherein an insulator is applied on the surfaces of the fine metal wires and the surfaces of parts, which have a possibility of coming into contact with the fine metal wires, of the inner leads. CONSTITUTION:Electrodes 10 on a semiconductor chip 1 and inner leads 4 are connected to each other by fine metal wires 2. Moreover, after an insulator 3 is applied on the wires 2 or on the lead parts 4 to insulate electrically the fellow wires 2 or the wires 2 and the leads 4 from each other, the electrical insulation is finished by a resin sealing and a molding. Thereby, even if the fine metal wire and the fine metal wire or the fine metal wires and the inner leads come into contact to each other in the resin sealing process, both are not electrically connected to each other and a highly reliable insulation can be obtained. |
