发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To perform positioning easily and effectively by providing a first positioning and connecting mechanism on the opposed faces of a base an an insulating board, and a second positioning and connecting mechanism on the opposed faces of the board and an electrode member. CONSTITUTION:A first positioning and connecting mechanism 13 for connecting an insulating board 2 to a base 1 in a state of a predetermined mounting position is provided on opposed faces, and a second positioning and connecting mechanism 14 for connecting an electrode member 3 to the board 2 in a state of a predetermined mounting position is provided on the opposed faces of the board 2 and the member 3. The board 2 is positioned on the base 1 and the member 3 is positioned on the board 2 in case of solder securing by connecting the protrusions 13a, 14a to recesses 13b, 14b. Thus, it can be easily and accurately conducted.
申请公布号 JPH02135761(A) 申请公布日期 1990.05.24
申请号 JP19880290715 申请日期 1988.11.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 ADACHI TOSHINORI
分类号 H05K7/20;H01L21/52;H01L23/13;H01L23/32;H01L25/04;H01L25/07;H01L25/18 主分类号 H05K7/20
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