| 摘要 |
PURPOSE:To make no stress applied to an electronic component by coating it with a thermoplastic adhesive, inserting a printed circuit board in which the components are mounted into an injection mold, and adhering the board to a reinforcing member when the reinforcing member is molded. CONSTITUTION:A flexible printed circuit board 7 in which electronic components 8 are mounted and a synthetic resin reinforcing member 9 are adhered to the mounting face of the board 7, i.e., with thermoplastic adhesive coating the face on which the components 8 are mounted, and at least part of the components 8 is disposed in a buried state in the member 9. Thus, substantially the same rigidity as that of the member 9 can be provided in the board 7 to prevent vibration, etc., to be applied to the member 9 from being applied to the component 8 as a stress. |
