| 摘要 |
<p>PURPOSE:To prevent the lowering of insulation between inner and outer leads which is caused by seeping moisture infiltrated from a mold resin by filling a contact face between the mold resin and a white resin reflecting film with a thermosetting resin. CONSTITUTION:In a semiconductor photocoupler which is sealed with a mold resin and causes light signals emitted by a light emitting element 2 to be inputted into a photodetector 3 in such a way that a transparent substance 4 having a facing face which is covered with a white resin reflecting film 5 is used as a conducting passage for the foregoing light signals, a contact face between the mold resin 7 and the white resin reflecting film 5 is filled with a thermosetting resin 10. For example, a through hole 8 reaching the inside of transparent and white resins 4 and 5 is installed at the periphery of the mold resin part 7 and a gap 6 is produced between both resins 4 and 5 and the resin 7 after forming a mold. The thermosetting liquid resin 10 flows into the gap 6 through the through hole 8 and then its gap is filled with the above resin 10 and a semiconductor coupler is thus sealed by a subsequent thermal setting treatment.</p> |
