| 摘要 |
PURPOSE:To improve sticking power in Al electroplating by adding a specified amt. of a specified org. solvent to a molten salt bath consisting of an aluminum halide and butylpyridinium chloride. CONSTITUTION:A molten salt bath consisting of 50-80mol% aluminum halide represented by a formula AlX3 (where X is F, Cl, I or Br) and 20-50mol% butylpyridinium chloride (C5H5N-C4H9Cl) is prepd. and one or more among diethylbenzene, cumene, mesitylene, dichlorobenzene and trichlorobenzene are added to the molten salt bath by 0.2-3mol per 1mol aluminum halide. Al plating is carried out in the org. solvent added plating bath with DC or pulsating current at 0-150 deg.C bath temp. and 0.02-50A/dm<2> average current density. Sticking power is improved by the plating bath.
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