| 摘要 |
<p>PURPOSE:To make it possible to selectively modify treating processes and to obtain a manufacturing device having a high throughput of treatment by a method wherein the process for materials to be treated having a plurality of treating processes arranged opposite to one another is selected in a desired order of process and the materials to be treated are transferred. CONSTITUTION:In a carrying-in/carrying-out mechanism 120, which selects a plurality of processes arranged opposite to one another and transfers wafers W, a tweezers 121 delivers wafers W previous to treatment to tweezers 112 and 113 of a transfer device 110 and an interface to receive wafers W subse quent to treatment is provided at the boundary between a passage 102 and the mechanism 120. The wafers W are subjected to treatment at treating stations 103 to 108 according to a prescribed order. The operation of this device 110 is controlled by a control system. Accordingly, by modifying a program of the control system, the treatments at the treating stations can be arbitrarily set. Thereby, the throughput of the treatments which can correspond to various processes can be increased.</p> |
