| 摘要 |
A large number of IC device holes are formed in a carrier tape, and a metal foil is formed on one surface of the tape. The metal foil is etched to form finger leads each having an end projecting into a corresponding IC device hole. Connection leads for connecting finger leads connected to different IC devices are formed on the other surface of the carrier tape. An IC device is located in each IC device hole and bonded to the finger leads. The carrier tape is cut so as to form an IC unit having a plurality of IC devices. Upon this cutting, a conductive lead for plating for connecting the finger leads with each other is cut. The IC unit simplifies wiring on the substrate and increases positioning efficiency with respect to the connection terminals. |
