| 摘要 |
PURPOSE:To achieve highly reliable and inexpensive packaging by printing a reflow pad and a guide pattern connected to a signal pin simultaneously and then forming a protrusion for positioning on the guide pattern. CONSTITUTION:A reflow pad 11-1 group connected to a signal pin 2-1 of a pin grid array type semiconductor package (LSI) 2 and two or more guide patterns 11-2 located at a position opposing a guide pin 2-2 are simultaneously printed and a protrusion 12 for positioning is formed on the surface of the guide pattern 11-2 by a solder 11-2a. Then. the guide pin 2-2 of the LSI 2 is engaged to the protrusion 12 for positioning, the signal pin 2-1 is allowed to contact the reflow pad 11-1, and the LSI 2 is packaged by fluxing a spare solder 11-1a provided at the signal pin 2-1 and the reflow pad 11-1. It achieves a packaging which is highly reliable and inexpensive. |
