| 摘要 |
PURPOSE:To prevent bonding by erroneous recognition and to improve productivity by previously forming a reference pattern for recognizing a bonding unit near a bonding pad. CONSTITUTION:A reference pattern 5 for recognizing a bonding unit is previously formed adjacently to the leftmost end of bonding pads 4 aligned in a lateral row on a board 1. When a bonding is conducted by the board 1, the unit first detects the pattern 5 of the board 1, then detects the pads 4 to be bonded, and bonds between the pad 4 and bonding pads 3 of a mounting component 2 on the board to electrically connect them. Accordingly, the pads 4 are not erroneously recognized at the time of start of bonding. |
