| 摘要 |
A moulded chip carrier includes an integral carrier body (22) made from a first moulded section (52) having a predetermined shape and a second moulded section (54) having a second predetermined shape. One (52) of the first and second moulded sections is made from a non-conductive material and the other section (54) is made from a non-conductive material that is capable of receiving a deposit (78) of conductive material. A conductive material is deposited on the outer exposed surface (74) of the moulded section (54) capable of receiving the deposit. This particular moulded section (54) has an outer surface that defines a plurality of non-intersecting, continuous paths (40) that form the input/output leads on the carrier body. The chip carrier includes a protective cap (26) that can be placed over an electronic chip (25) mounted within the carrier body (22). |
