| 摘要 |
PURPOSE:To produce a product at a high yield and to enhance its conversion efficiency by a method wherein an insulating film layer is formed of a silica film, having a prescribed film thickness, formed by hardening a coating agent which is composed mainly of an organic silicate. CONSTITUTION:A silica film, with a film thickness of 3 to 12mum, formed by hardening a coating agent which is composed mainly of an organic silicate is used for an insulating film layer 6 with which the surface of a metal substrate 1 is covered. Accordingly, a close contact property between the insulating film layer and a rear electrode 2 or an amorphous semiconductor layer 3 formed on it is made stronger; it is possible to restrain the layer from being stripped off by a bend, moisture or the like. In addition, since the close contact property of the insulating film layer 6 is enhanced by using a single film composed of a silica film by hardening in organic silicate without using a resin layer, it is possible to prevent a conversion efficiency from being lowered. |
