发明名称 METHOD FOR PROCESSING DATA OF WIRE BONDER
摘要 PURPOSE:To improve operating efficiency, to enhance reliability, and to always obtain stable data by obtaining a contact detection signal by the contact detector of a device, and registering a bond face height therewith. CONSTITUTION:When the key of a console 4 is pressed, a board table is moved, a measuring position on the table is moved to a position directly under a capillary 5, and the capillary starts falling. When the capillary is brought into contact with a target, a contact detection signal is input to a MPU 7 by the contact detector 6 of the device. Thus, the MPU sends a stop command to an NC device 8 to stop the falling of the capillary. Then, the MPU receives the present position data of the capillary from the NC device, and stores it as height data in the automatic operation data 9 or facility intrinsic parameter 10 of the memory thereof. Thereafter, the capillary is raised to an origin position, the table is moved to a camera side, and finished. In this system, the bond face height data registered before the capillary is replaced is corrected by the height of the capillary attached at present to obtain an accurate bond face height.
申请公布号 JPH02125438(A) 申请公布日期 1990.05.14
申请号 JP19880278689 申请日期 1988.11.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ICHIHARA MASARU;IRITANI MASAO
分类号 H01L21/60 主分类号 H01L21/60
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