| 摘要 |
PURPOSE:To prevent occurrence of edge beads by employing the portion, to be left after etching, of the metallic plated layer formed with uniform thickness on the entire face of a conductive base material through first process as it is as a conductor circuit. CONSTITUTION:Preferably, planar conductive base material 1 has resistance against chemicals used during electrolytic plating and against corrosion. Metallic plated layer 2 to be formed on the surface of the conductive base material 1 finally constitutes a conductor circuit 4 and the thickness thereof is made identical to that of the conductor circuit 4. Thin metal film 5 existing on the surface of insulating material except the pattern on the conductor circuit 4 is removed during etching process. At this time, the metallic plated layer 2 of the conductor circuit 4 is removed simultaneously by the thickness corresponding to that of the thin metallic film 5. The thin metallic film 5 as thick as that to be etched is also existing at the side of the conductor circuit 4 buried in the insulating material 6. Consequently, the overall thickness of the conductor circuit 4 will be as thick as that formed during the first process. |
