| 摘要 |
PURPOSE:To obtain a ceramic wiring board able to be burned at higher temperature than in the past and having high reliability by burning a ceramic multilayer wiring board having a conductor containing Ag or an Ag alloy on the surface and between layers of a ceramic sheet laminated in multilayers. CONSTITUTION:Ag paste is screen-printed on a green sheet made of ceramic, wherein a viahole is formed, and at the same time the inside of the viahole also is filled with Ag paste. A plurality of sheets like this are piled up to be pressure-fixed for being laminated. An unburnt ceramic board made in this way is heated in the atmosphere to be given debinding treatment. Next, nitrogen gas is introduced into a furnace for being replaced by oxygen concentration under 50000ppm followed by burning in order to obtain a ceramic multilayer wiring board. |
