发明名称 GRINDING DEVICE FOR WAFER OF SEMICONDUCTOR
摘要 PURPOSE:To prevent the pollution of the grinding face of transfer time by providing a grinding face protection cover having the protection and cleaning function of the grinding face on the transfer part of just after grinding. CONSTITUTION:A grinding face protection cover 12 having a cleaning function is provided on the transfer part of just after grinding. Thus the activating grinding face is held in a wet state always and the cooling water of a grinding blade containing dirt (due to serving for the cleaning of the water grinding face as well), etc., are not dried with their adhesion as they are. Also the grinding face can be protected from the dirty water which flies up mist-likely by the high rotation of the grinding blade by the grinding face protection cover 12, which is stored on a spindle cover 11 and drips down thereafter. Consequently, the dirt can completely be removed by a spinner cleaning part 8.
申请公布号 JPH02116471(A) 申请公布日期 1990.05.01
申请号 JP19880266413 申请日期 1988.10.21
申请人 MATSUSHITA ELECTRON CORP 发明人 SHIMOTORI TATSUO
分类号 B24B55/02;H01L21/304 主分类号 B24B55/02
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