| 摘要 |
PURPOSE:To reduce the number of times of baking for facilitating the circuit design further enhancing the reliability of an insulating layer by a method wherein the number of metallic cores of enameled substrates is increased more than two each. CONSTITUTION:The first metallic core is specified as a grounding circuit while the second metallic core is specified as e.g., 6V or 12V power supply line and after enameled electrodepositing and baking processes, an opening for viahole is made at required position to printed-bake the enameled circuit 3. Through these procedures, the freedom of circuit design is augmented to make the circuits very efficient further reducing the baking times required of at least four times down to only one time so that the deterioration of insulating layer due to the baking process may be avoided thereby enhancing the reliability of the title substrate. |
