| 摘要 |
PURPOSE:To make it possible to prevent an unfilling of a molding resin and the generation of a defective due to voids in molded items by a method wherein a plurality of semiconductor chip-lead frame units are arranged in molding dies making their lead frames come into contact to each other and the molding resin is pressed and fed from places where the lead frames exist. CONSTITUTION:Semiconductor chips 7 are installed at prescribed positions of a lead frame 6 and semiconductor chip-lead frame units 20 formed by connecting electrically the chips 7 and the lead frame 6 to each other are charged in molding dies 1 and 9 and are sealed by pressing, feeding and hardening a molding resin. In case a semiconductor device is manufactured in such a way, a plurality of pieces of semiconductor chip-lead frame units 20 are arranged in the above molding dies 1 and 9 making their lead frames 6 come into contact to each other and a molding resin is pressed and fed from places where the above lead frames exist. Thereby, as the flow resistance of the flow path of the molding resin can be roughly made uniform, an unfilling of the molding resin and the generation of a defective due to a void in molded items can be prevented. |
