PACKAGE FOR INTEGRATED CIRCUIT USE,申请号JP19880258721-传众专利搜索

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发明名称	PACKAGE FOR INTEGRATED CIRCUIT USE
摘要
申请公布号	JPH02105459(A)	申请公布日期	1990.04.18
申请号	JP19880258721	申请日期	1988.10.13
申请人	NEC CORP	发明人	ISHIGURO HIDEO
分类号	H01L23/02;H01L27/14	主分类号	H01L23/02
代理机构		代理人
主权项
地址

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