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发明名称
Semiconductor package having an outwardly arced die cavity
摘要
申请公布号
US4918512(A)
申请公布日期
1990.04.17
申请号
US19880286676
申请日期
1988.12.19
申请人
MOTOROLA, INC.
发明人
OWENS, NORMAN L.
分类号
H01L23/02;H01L23/13
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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