| 摘要 |
<p>PURPOSE:To aim at high definition and efficiency of electron emission even in a simple manufacturing process by forming, on a base, a plurality of filaments supported by conductive paths by a dry-etching process. CONSTITUTION:A lower layer film 4 made of Cu and an upper layer film 5 made of Ta are formed on an insulating base 1. A resist is coated on the film 5, a filament pattern and a conductive path pattern are etched by exposure, and consequently a resist pattern 6 having the conductive path in width of 200mum and the filament in width of 5mum. A part of the films 5 and 4 not having the patterns is removed by a dry etching method using the pattern 6 as a mask, and therefore the filament 3 and the conductive path are formed. The film 4 is dry-etched by using an etchant having selectability out of Cu and Ta. Upon completion of the etching at the time when the film 4 under the filament 3 is removed, wide conductive paths 2a-2d remain. Thus, the conductive paths can serve as the supporter of the filament, thereby achieving efficient electron emission having low wiring resistance and high definition in a simple constitution.</p> |
