| 摘要 |
<p>PURPOSE:To make possible the high-density packaging of an electronic component without short-circuiting and to obtain a highly reliable substrate for electronic component mounting use, in which a migration is hardly generated even in a long-term use, by a method wherein openings formed in an insulative resin are respectively formed in every connection part between each conductor pattern and each lead and moreover, the fellow adjacent openings are arranged in a zigzag configuration. CONSTITUTION:In a substrate 1 for electronic component mounting use of a structure, wherein conductor patterns 3 on the substrate 1 are protected with an insulative resin 4 and at the same time, part of each of the patterns 3 is exposed from each opening 2 formed in the above resin 4 and is electrically connected with each lead 5 for external connection use, the above opening 2 is formed in every connection part between each pattern 3 and each lead 5 and the fellow adjacent openings 2 are arranged in a zigzag configuration. For example, fine conductor patterns 3 are formed on a substrate 1 and an insulative resin 4 is applied and cured leaving a die pad 6 for mounting an electronic component 11 and inside and outside opening parts 22 and 32 for connecting places, where are connected with the component 11, on the patterns 3 and the leads 5 to each other. Moreover, the openings 22 and 32 and the leads 5 are electrically connected to each other with a solder.</p> |
