Curable formulation based on reaction prod. of polyphenylene ether - with unsatd. carboxylic acid or anhydride, polyepoxide cpd. and epoxy cure catalyst

摘要

Curable formation consists of (a) a reaction prod. (I) of polyphenylene ether(s) (II) with unsatd. carboxylic acid(s) (IIIA) or unsatd. anhydride(s) (IIIB), (b) polyepoxide cpd(s). (IV) and (c) epoxy hardening catalysts (V). (II) has Mn = min. ca. 12000. (IV) consists of polyglycidyl ether(s) of a bisphenolic cpd., of formula (IVA) Glyc-O-A1-Y-A2- (OCH2CH(OH)O-A1-Y-A2)x-O-Glyc (IVA) Glyc = the glycidyl gp.; A1 and A2 independently = a monocyclic divalent aromatic gp.; esp. p-phenylene; Y = a bridging gp. with 1 or 2 atoms sepg. A1 from A2; esp. propylidene; x has an average value to up 1; esp. 0, either alone or mixed with a smaller amt. of aryl monoglycidyl ether(s) and non-bisphenolic polyepoxy cpd(s). The formulation contains up to 90 (wt)% (I) w.r.t. (I)-(IV) and (III) is maleic anhydride or fumaric acid. In particular, (II) is a poly(2,6-dimethyl-1,4-phenylene ether) (IIA) with MN = ca. 15000-40000 in an amt. of ca, 30-85% w.r.t. (I) + (IV). (V) is Al tris(acetylacetonate) (VA) or Zn bis(acetylacetonate) and is used in an amt. of 0.5-10% w.r.t. (I) + (IV). The formulation pref. also contains phenolic cpd(s). (VIA) or basic N cpd(s). (VIB) as hardening accelerator, pref. (VIB) an amt. equiv. to ca. 1000-15000 ppm basic, involatile N w.r.t. (I) + (IV) + (V), esp. ca. 1500-2500 ppm tetramethylguanidine. USE/ADVANTAGE - The formulation is claimed for use in curable materials with a substrate of fibre, esp. glass fibre, the prods. obtd. by thermal cure of these and PCBs consisting of these prods. covered with a conductive metal, esp. Cu. The cured composites (laminates) have improved solvent resistance and solderability.