| 摘要 |
<p>The invention relates to a new material for molding elements as well as molds made with such material. The material contains more than 30 % of vitrious silica and various adjuvants and binders and has the advantage of modulating the thermal conductivity of the molds. Application to all industries utilizing the shaping by molding of liquid or pasty materials, or by heat deformation of flat products.</p> |
