HALBLEITERVORRICHTUNG UND VERFAHREN ZU DEREN HERSTELLUNG

摘要

An apertured sheet of ceramic is bonded to a base sheet of ceramic to form an array of open cavities, in each of which a semiconductor element (10) is mounted. The base sheet carries a pattern of electrically conductive tracks (5, 6, 7) to which the semiconductor element is connected and the tracks are connected to plated-through holes (41, 42, 43) extending through the thickness of the base sheet. The elements are then tested, and the cavities sealed with a common lid. The sheets are diced to form a plurality of separate devices, the sheets being cut along the center lines of the plated-through holes, so that the conductive surfaces thereby exposed can be used to mount the devices on printed circuit boards.