| 摘要 |
PURPOSE:To surely form a solder layer at a lead terminal without destroying an IC and a connection part of the IC and the terminal by a method wherein a protective member is formed on a sealing resin and a solder flows out from a solder-supply part arranged at the upper part of the protective member. CONSTITUTION:A solder 11 which has been kept at a definite temperature flows out at a definite flow rate from a solder-supply part 10; its flow is changed in two directions by a protective member 12. while the solder 11 flowing in the two directions flows along individual slopes of the protective member 12, it approaches a flexible tape 13. In addition, it is moved on lead terminals 15 and covers the surface; one part flows out from a gap between the lead terminals, travels along the rear of the leads and covers them. However, the solder 11 does not flow out to a sealing resin 14 and its neighborhood. Thereby, a thermal influence of the solder 11 on an IC chip and the sealing resin 14 is eliminated; it is possible to prevent the IC chip or a connection part of the IC and the leads from being destroyed. |
