发明名称 Notch-cut semiconductor wafer, and method and apparatus for chamfering the notch.
摘要 <p>A notch-cut semiconductor wafer whose notch has its both corners entirely chamfered, and an apparatus and method for chamfering the notch as such, which employs a positioning means for positioning the wafer such that the notch of the wafer points in a predetermined direction; a conveyor means for conveying the wafer to a chamfering position; a holding means for holding the wafer to bring the wafer to arbitrary places; an abrasive wheel having an edge which is shaped like the notch; a driving means for driving the abrasive wheel; and a means for controllingly moving at least one of the two items consisting of the abrasive wheel and the semiconductor wafer, to arbitrary places.</p>
申请公布号 EP0360939(A1) 申请公布日期 1990.04.04
申请号 EP19880309130 申请日期 1988.09.30
申请人 SHIN-ETSU HANDOTAI COMPANY, LIMITED 发明人 SEKIGAWA, TOSHIO C/O SHIN ETSU;YOSHIHARA, KENICHI C/O SHIN ETSU
分类号 B24B9/06 主分类号 B24B9/06
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