发明名称 |
Notch-cut semiconductor wafer, and method and apparatus for chamfering the notch. |
摘要 |
<p>A notch-cut semiconductor wafer whose notch has its both corners entirely chamfered, and an apparatus and method for chamfering the notch as such, which employs a positioning means for positioning the wafer such that the notch of the wafer points in a predetermined direction; a conveyor means for conveying the wafer to a chamfering position; a holding means for holding the wafer to bring the wafer to arbitrary places; an abrasive wheel having an edge which is shaped like the notch; a driving means for driving the abrasive wheel; and a means for controllingly moving at least one of the two items consisting of the abrasive wheel and the semiconductor wafer, to arbitrary places.</p> |
申请公布号 |
EP0360939(A1) |
申请公布日期 |
1990.04.04 |
申请号 |
EP19880309130 |
申请日期 |
1988.09.30 |
申请人 |
SHIN-ETSU HANDOTAI COMPANY, LIMITED |
发明人 |
SEKIGAWA, TOSHIO C/O SHIN ETSU;YOSHIHARA, KENICHI C/O SHIN ETSU |
分类号 |
B24B9/06 |
主分类号 |
B24B9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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