| 摘要 |
PURPOSE:To relax restriction of thickness of a circuit board, to change a depth of a dimple structure as required and to reduce the number of points connected by a metal thin wire by a method wherein an inside lead of a lead frame is formed to be of the dimple structure and the inside lead is connected directly to a pattern electrode on the circuit board. CONSTITUTION:The following are contained: a pattern electrode 11 which is connected to a circuit pattern electrode 11 formed on an insulating substrate and is installed in a periphery on the insulating substrate; a circuit board 1 which is mounted on the insulating substrate and is provided with an active element 12 and a passive element 13 which are connected to a circuit pattern; a lead frame 2 which is connected to a plurality of outside leads 21 to be connected to an external circuit, whose outside is connected to the individual outside leads 21, whose inside tip part is connected directly to the pattern electrode 11 and is bent and which is provided with a plurality of inside leads 22 forming a U-shaped dimple structure with reference to a face where the outside leads 21 have been formed and with a coupling bar 23 where the outside leads 21 and the inside leads 22 have been connected and which is cut in a final process; an outer packaging resin part 3 which seals the circuit board 1 and the inside leads 22. |
