| 摘要 |
PURPOSE:To sharply increase the number of electrodes to be formed and to prevent a short circuit between wires from being caused by a method wherein the electrodes are arranged in a zigzag shape on a semiconductor chip and on a ceramic package substrate used to mount the chip or on a lead frame. CONSTITUTION:Extraction electrodes 2, 3 and bonding pads 4, 5, which are arranged in two rows, are arranged in a zigzag shape on a semiconductor chip 1 and on a ceramic package substrate 6 mounting the chip on its surface in such a way that they are faced individually mutually. Accordingly, the chip extraction electrodes and the bonding pads are wire-bonded between mutually faced electrodes and pads such as between the chip extraction electrode 2 arranged at the outside and the bonding pad 4 arranged at the inside as well as between the chip extraction electrode 3 arranged at the inside and the bonding pad 5 arranged at the outside. |
