| 摘要 |
PURPOSE:To decrease the block error rate of pits by interposing a bond layer which imparts inter-layer bondability between a light reflection layer and other layer which sandwiches this layer. CONSTITUTION:The bond layer 6 which imparts inter-layer bondability is interposed between the light reflection layer 3 and the other layer which sandwiches this layer. Laser light is, therefore, converged and the inter-layer peeling takes place only in the extremely narrow range where the energy is concentrated at the time of irradiating the light absorption layer 2 with the laser light 7 to form the pit 5. The pits 5 which are distinct as compared with the case in which the bond layer 6 is not interposed are formed in this way. The resolving power of the pits 5 is thus enhanced and the block error rate is lowered. |
