发明名称 |
Semiconductor bonding means having an improved capillary and method of using the same |
摘要 |
A wire bonding capillary for a bonding process comprises an elongated capillary body having an axial bore through the body for receiving a wire of a predetermined diameter to be bonded, and a working face on one end of the body for applying force to the bonding wire during the bonding process. The working face includes a first surface portion surrounding the bore and having a first radius of curvature, and a second surface portion adjacent to the first surface portion and having a second radius of curvature smaller than the first radius curvature.
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申请公布号 |
US4911350(A) |
申请公布日期 |
1990.03.27 |
申请号 |
US19890327626 |
申请日期 |
1989.03.24 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
ARAKI, KOUJI;KATO, TOSHIHIRO |
分类号 |
H01L21/60;B23K20/00;H01L21/607 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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