| 摘要 |
PURPOSE:To increase mount density for effective heat dissipation by joinning into a multiple stage highly heat-radiable board, on which semiconductor devices have been mounted, with a plurality of insulating layers put between the adjacent boards. CONSTITUTION:The whole surface of a board having a metal core 1 comprising a highly heat-radiable board material through which a through-hole 2 is formed is cov ered with an insulating film 3, on which a wiring conductor pattern 4 is formed. Chip parts 13 and semiconductor device 14 are mounted on the conductor pattern 14. Resin such as polyamide resin 7, etc., is sticked through an adhesive 8 to the regions of the through-hole 2 and the conductor pattern 4 and to the mounted regions of the parts 13 and 14, to form an insulating layer. Then, the mounted regions of the parts 13, 14 are chiefly sealed with epoxy resin 9 and the like. A plurality of the boards are joined with each other by an adhesive 10, and conductor paste 11 is forced to flow into the through-hole 2 and to conduct the boards, and further a heat sink fin 12 is mounted on the peripheral edge of the multiple board, for the purpose of forming a package. Hereby, not only the device 14 but the other parts 13 are mounted in a spatially ordered form to improve mount efficiency. Furthermore, the respectively boards form heat sink paths for the respective semiconductor devices to prevent heat concentration and hence improve heat radiability. |
