POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING, PREPARATION METHOD OF THE SAME, AND APPARATUS FOR CMP

摘要

PURPOSE: A CMP polishing pad is provided to minimize phenomenon degrading transparence or forming protrusions, and to easily a detect polishing-finish point. CONSTITUTION: A CMP polishing pad comprises: a pad main body comprising a polymer resin; a transparent window comprising thermosetting or photocurable resin comprising one or more kinds from a group consisting of phenol resin, urea resin, melamine resin, epoxy resin, and polyester resin. A CMP apparatus comprises the CMP polishing pad, a rotatable platen, a supply part supplying polishing slurry to the polishing pad; and a head part accepting a wafer supposed to be polished on the pad.