SEMICONDUCTOR COOLING APPARATUS AND ITS MANUFACTURE

摘要

PURPOSE:To suppress the creation of a nonuniform temperature distribution in a chip and reduce a load applied to connecting solder grains by a method wherein a coolant supply means is so arranged as to make the direction of the flow of the coolant practically in parallel with the rear of the chip. CONSTITUTION:A module board 3 is sealed with a module sealing cap 8 and side wall sealing plates 9 and the inside of the module is filled with coolant. The module board 3, the module sealing cap 8 and the side wall sealing plates 9 are jointed with each other with solder 10 or the like. The coolant is supplied to the module through an entrance 5 and distributed to a coolant supply means 4 such as nozzles by a header 6 to cool respective chips 1 individually. After the coolant cools the respective chips 1, the coolant is discharged out of the module through an exit 7. The coolant supply means 4 which cools the chip individually and directly spouts out the coolant in the direction practically in parallel with the rear of the chip 1. The coolant spouting outlet of the coolant supply means 4 has a width approximately equal to the width of the chip in order to cool the chip efficiently.