| 摘要 |
PURPOSE:To improve a mounting density per unit space substantially by a method wherein pads on the surface of a second IC pellet provided behind a first IC pellet are connected electrically to the pads on the rear of the first IC pellet with bumps. CONSTITUTION:Holes piercing through a first IC pellet are formed by a laser and the holes are filled with melted solder to form conductors 7 between pads on the surface and rear of the first IC pellet. Bumps 4 are placed on the pads on a second IC pellet and the first IC pellet is placed so as to cover the second IC pellet. The layout positions of the pads 2 on the surface of the second IC pellet are determined in view of the layout positions of the pads 6 on the rear of the first IC pellet. If the pads 2 are connected electrically to the pads 6 with the bumps 4 when the two pellets are laminated, the first IC and the second IC are connected to each other electrically through the pads and bonding is completed. |
