发明名称 Method and device for making contact between an electrical lead wire and contact points on a printed circuit board
摘要 A method and a device for making contact between a corrective conductor (pink wire) and conductor runs on a printed circuit which is provided on a circuit board, in the case of which method and device the corrective conductor is fitted, in order to modify the printed circuit, between the completion of the printed circuit on the printed circuit board and the population of the circuit board with the components, a power supply in order to make electrical contact with the corrective conductor being selected which is greater than the power supply which is used for subsequently making contact with the components.
申请公布号 DE3831394(A1) 申请公布日期 1990.03.22
申请号 DE19883831394 申请日期 1988.09.15
申请人 BASU, PRITHWIS, 8000 MUENCHEN, DE;MIGGE, DIETER, 8057 ECHING, DE 发明人 BASU, PRITHWIS, 8000 MUENCHEN, DE;MIGGE, DIETER, 8057 ECHING, DE
分类号 B23K26/20;H05K3/22;H05K3/30;H05K3/32;H05K13/04 主分类号 B23K26/20
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