CONSTRUCTION FOR GROUNDING STATIC BREAKDOWN PROTECTIVE LAYER IN ELECTRONIC DEVICE

摘要

PURPOSE:To facilitate an insured grounding connection and eliminate a special process required for the grounding wire connection and reduce the necessary area by a method wherein a bonding wire near a ball-bonding part or a tail- bonding part is brought into contact with a static breakdown protective layer to ground the static breakdown protective layer. CONSTITUTION:A wire-bonding film 2 composed of an Al film or the like is provided on a board 6 adjacent to a static breakdown protective layer 1. A bonding wire 5 is ball-bonding so as to place a ball-bonding part 3 on the wire-bonding film 2 and the static breakdown protective layer 1. As the wire- bonding film 2 is composed of a film such as an Al film which can be wire- bonded normally, the ball-bonding part 3 is securely bonded to the wire-bonding film 2. The ball-bonding part 3 on the static breakdown layer 1 is not bonded solidly to the static breakdown protective layer 1 but is brought into contact with the surface of the protective layer 1 and electrically connected to it satisfactorily. A contact point A is formed between the static breakdown protective layer 1 and the ball-bonding part 3. The other end of the bonding wire 5 is tail-bonded to a ground potential wiring part 9.