| 摘要 |
A composite film comprising an additive layer (5) and an insulating layer (4) containing an epoxy resin and a synthetic rubber as major components, is used in the manufacture of printed wiring boards via the additive method. The composite film is laminated on both sides of a substrate, especially an inner layer circuit substrate, and cured. Through-holes are drilled, and the resulting laminate is masked with a plating resist, roughened and electrolessly plated. |
| 申请人 |
HITACHI CHEMICAL CO., LTD.;HITACHI CONDENSER CO. LTD.;THE YOKOHAMA RUBBER CO., LTD. |
发明人 |
TAKAHASHI, HIROSHI;TAKANEZAWA, SHIN;KANNO, MASAO HITACHI KASEI KOGYO K.K.;OKAMURA, TOSHIRO;FUKUTOMI, NAOKI;YOKOYAMA, HIROYOSHI;WATANABE, HIDEO;YAMAZAKI, HAJIME;WAKAMATSU, HIROYUKI;TAKAHASHI, TOSHINOBU |
