SELECTIVE ELECTROLESS PLATING OF VIAS IN VLSI DEVICES,申请号EP19870301519-传众专利搜索

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发明名称	SELECTIVE ELECTROLESS PLATING OF VIAS IN VLSI DEVICES
摘要
申请公布号	EP0236034(A3)	申请公布日期	1990.03.21
申请号	EP19870301519	申请日期	1987.02.23
申请人	AMERICAN TELEPHONE AND TELEGRAPH COMPANY	发明人	GEORGIOU, GEORGE E.;POLI, GARY NICHOLAS
分类号	H01L21/3205;C23C18/18;C23C18/32;H01L21/288;H01L21/768;H01L23/522;(IPC1-7):H01L21/288	主分类号	H01L21/3205
代理机构		代理人
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