| 摘要 |
<p>PURPOSE:To prevent a first electronic component from being touched and damaged by a cover when it is attached to a substrate by packaging the first electronic component in a recess provided in the substrate, attaching the cover so as to cover the recess and packaging a second electronic component on the surface of the substrate around the recess. CONSTITUTION:A substrate 1 is previously provided with a recess 2 deep enough to receive an electronic component completely. A first electronic component 3 such as LSI chip or the like is packaged in the recess 2 by soldering for example. A second electronic component 4 such as a leadless chip carrier or the like is packaged on the surface of the substrate around the recess 2. Since the first electronic component 2 has leads consisting of wire with a diameter of several tens micrometers, at least a cover 5 for mechanical protection is attached to the substrate 1 by means of an adhesive or the like so as to cover the recess 2.</p> |
