| 摘要 |
PURPOSE: To improve the mounting reproducibility of a flip chip, by surrounding a solder connecting section formed on the rear surface of a semiconductor chip with a solder stop layer coated with an oxide layer at the time of welding the solder connecting section to a conductor layer provided on a substrate. CONSTITUTION: A semiconductor chip 5 is fixed on a substrate 1 through a solder connecting section 7 which is constituted by forming conductor tracks 2, each of which is formed by laminating conductors 2a and 2b upon another, on a substrate 1 at a prescribed interval and bringing solder bumps 6 provided on the rear surface of the chip 5 into contact with the tracks 2 across the intervals, and then, melting and solidifying the bumps 6. In this constitution, the interval D1 between the substrate 1 and the rear surface of the chip 5 and the intervals D2 between the substrate 1 and solder stop layer 3 provided on the tracks 2 are set to D1 >D2 , and the peripheries of the bumps 6 are surrounded with stop layers 3 having oxide layers 4 on its surfaces. The stop layers 3 are formed of an oxidizable metal and the oxide layers 4 are formed with plasma. When the connecting section 7 is constituted is such a way, the chip 5 becomes parallel to the substrate 1, because the layers 3 can inhibit the inclination of the chip 5. |
