| 摘要 |
<p>PURPOSE:To make the mounting space on a board small even if the quantity of semiconductor chips increases and to decrease the delay of information transmission speed by storing plural semiconductor chips in stage shape in one package. CONSTITUTION:When connecting each part, only the chip select signal lines are arranged so that the signal may be used like a block select signal when viewed from the outside of a package 1 by assigning one lead part of a lead frame 3 to each of RAM chips 2, and signal lines other than the chip select signal lines are arranged such that the leads 7 for the same signal of all the chips are connected onto one lead. By the leads 7 each chip 2 is connected electrically, and also by that rigidity each chip 2 is stored in stage shape in the package 1.</p> |
