| 摘要 |
<p>PURPOSE:To improve the high frequency characteristics of a high speed/high frequency integrated circuit by providing a plurality of cavities at each functional constituent unit in a package. CONSTITUTION:A frame 12 having a plurality of openings for dividing and containing a high speed/high frequency integrated circuit composed of a plurality of elements at each functional constituent unit is provided on a metal base 1. Cavities 13-16 are formed to be surrounded by the frame 12. The surfaces of the cavities in the frame 12 are metallized by a metal layer except a high frequency input/output terminal 6, a low frequency input/output terminal 7, a bias voltage supplying terminal 8 and a ground terminal 9. Thus, the size of the cavities can be so designed as to bring the resonance frequency of each cavity to sufficiently higher frequency than the operating frequency of high speed/high frequency integrated circuit for placing it, thereby easily obtaining a package for the integrated circuit having higher functions.</p> |
