| 摘要 |
PURPOSE:To suppress the occurrence rate of through hole defects to a minimum by performing a conduction test of a pattern only through a panel plated layer, thereafter forming an intrinsic pattern by pattern plating with electrolyte copper plating and etching, and performing a conduction test. CONSTITUTION:A conduction test is performed for a printed board comprising only a panel plated layer. Whether a through hole defect due to panel plating is present or not is judged. When the presence of the defect is judged, the plating conditions such as the concentration of electroless copper plating liquid are made adequate. When the plating defect is not found, pattern plating is performed until a specified thickness is obtained by electrolyte copper plating. Etching is performed, and the printed board is formed. The presence or absence of the defect in the pattern plating is judged for the printed board by a conduction test. When it is judged that the defect is present, the concentration of the plating liquid, temperature, current and the like are adjusted adequately. In this way, the occurrence rate of the through hole defects in the mass production process can be reduced to a minimum. |
