发明名称 TRANSPARENT CONDUCTIVE LAMINATION BODY
摘要 <p>PURPOSE:To improve the scratch resistance and the dotting characteristics of a transparent conductive thin film by forming the transparent conductive thin film having a predetermined thickness on one surface of a transparent film base having a predetermined thickness, and pasting transparent base material to the other surface via a transparent pressure sensitive adhesive. CONSTITUTION:As a film base 1, a material having the predetermined thickness is used and a conductive thin film 2 is formed on one surface thereof. Also, a transparent base material 4 is pasted to the other surface via a transparent pressure sensitive adhesive layer 3. In this case, the thickness of the film base 1 shall be 2 to 120mum. Also, the thickness of the conductive thin film shall be 50Angstrom or more. Furthermore, as the adhesive layer 3, there are used, for example, acryl adhesive layer, silicone adhesive layer, rubber adhesive layer and the like having an elastic coefficient of 1X10<5> to 1X10<7>dyn and a thickness of 1mum.</p>
申请公布号 JPH0266809(A) 申请公布日期 1990.03.06
申请号 JP19880218149 申请日期 1988.08.31
申请人 NITTO DENKO CORP 发明人 SUGAWARA HIDEO;KAWAZOE SHOZO;KAWAGUCHI MASAAKI
分类号 H01B5/14;B32B7/02;B32B7/12;G06F3/033;G06F3/041 主分类号 H01B5/14
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