发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To make it possible to detect various kinds of abnormalities arising during work during that work by detecting the height of a tool at the time of individual bonding so as to memorize it, and comparing the difference to the reference value with a tolerable value. CONSTITUTION:The height when a bonding tool 6 is pressed down is detected during individual bonding work and is memorized. And the detected height H is compared with a reference value H0, and when the absolute value of its difference H is larger than the tolerable value, it judges it abnormal and issues an alarm. The reference value H0 is determined by calculating the average value of first several bondings. Hereby, various kinds of abnormalities arising during work can be detected during that work. Further, the reference value H0 can be renewed by calculating the average value at every bonding point.
申请公布号 JPH0265146(A) 申请公布日期 1990.03.05
申请号 JP19880218029 申请日期 1988.08.30
申请人 FUJITSU LTD;KYUSHU FUJITSU ELECTRON:KK 发明人 BEPPU SHUJI;KOMASU SHIGERU
分类号 H01L21/60 主分类号 H01L21/60
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