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发明名称
MOUNTING OF ELECTRONIC COMPONENT BY EUTECTIC DIE BONDER
摘要
申请公布号
JPH0263130(A)
申请公布日期
1990.03.02
申请号
JP19880214038
申请日期
1988.08.29
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
IMAMURA TETSUKAZU
分类号
H05K13/04;H01L21/52
主分类号
H05K13/04
代理机构
代理人
主权项
地址
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