| 摘要 |
<p>PURPOSE:To obtain a lead frame which is not deformed by a distortion generated when it adheres to a board for placing electronic components by providing a cutout connected from an outer periphery to a tie bar. CONSTITUTION:Two cutouts 11 are respectively provided at the each of sides vertically to a profile lie in the same width as that of the interval of leads from the outer periphery 12 of a lead frame 10 to a tie bar 13. The cutouts 11 are simultaneously formed when the other opening of the frame 10 is formed by etching. The frame 10 adheres by solder 50 to a board 20 for placing electronic components to be formed with a conductive layer 21 of a fine pattern by photoetching as a QFP type electronic component placing board 20. That is, when the frame 10 adheres to the board 20, a distortion generated by the difference of the thermal expansion coefficients of both 10, 20 is absorbed by the cutouts 11.</p> |
