发明名称 METHOD FOR DIVIDING CERAMIC SUBSTRATE
摘要 PURPOSE:To reduce the longitudinal crack inferiority or burr of a short strip of ceramic substrate to a large extent by bonding a member having elasticity to the edge part of a receiving stand 1 or providing the member having elasticity or a spring in the receiving stand to provide elasticity to the edge part of the receiving stand and dividing the ceramic substrate around said edge part. CONSTITUTION:A member 8 having elasticity (e.g., a member formed by bonding paper of 0.05mm to a tape of about 0.1mm) is bonded to the surface of a receiving stand 1 composed of ultrahard material quality and, in such a state that the dividing groove 6 of a ceramic plate 4 extends along the edge part 1a acting as a fulcrum of the receiving stand 1, anti-breaking load 5 is applied to the ceramic substrate 4 to divide the same.
申请公布号 JPH0255107(A) 申请公布日期 1990.02.23
申请号 JP19880207029 申请日期 1988.08.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MAWAKI KAZUYUKI;YOSHIDA NORIBUMI
分类号 B28D5/00;H05K3/00 主分类号 B28D5/00
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